Fast delivery Low Melt EVA Bags For Silica - Low Melt Bags for Tire Industry – Zonpak
Fast delivery Low Melt EVA Bags For Silica - Low Melt Bags for Tire Industry – Zonpak Detail:
ZonpakTM low melt bags are also called rubber compounding bags or rubber ingredient bags in the tire industry. The bags are specially designed for packing rubber additives and chemicals used in the compounding or mixing process.
Bags with different melting points are suitable for different mixing conditions. Bags with melting point 85 deg. C are the most often used, while bags with melting point 72 deg. C are used for adding of accelerators. Improving work environment, ensuring accurate adding of additives and raising production efficiency are the main benefits of using low melt bags.
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Technical Standards |
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| Melting point | 65-110 deg. C |
| Physical properties | |
| Tensile strength | MD ≥16MPa TD ≥16MPa |
| Elongation at break | MD ≥400% TD ≥400% |
| Modulus at 100% elongation | MD ≥6MPa TD ≥3MPa |
| Appearance | |
| Surface of the product is flat and smooth, there is no wrinkle, no bubble. | |
Product detail pictures:
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With this motto in mind, we've got become among essentially the most technologically innovative, cost-efficient, and price-competitive manufacturers for Fast delivery Low Melt EVA Bags For Silica - Low Melt Bags for Tire Industry – Zonpak, The product will supply to all over the world, such as: Liverpool , Denmark , Senegal , All the imported machines effectively control and guarantee the machining precision for the products. Besides, we have a group of high-quality management personnels and professionals, who make the high-quality products and have the ability to develop new products to expand our market home and abroad. We sincerely expect customers come for a blooming business for both of us.
By Helen
from Auckland
- 2018.09.16 11:31
This is a honest and trustworthy company, technology and equipment are very advanced and the prodduct is very adequate, there is no worry in the suppliment.
By Anna
from Madagascar
- 2017.11.01 17:04
